Kaiam Assembly Process
- Bond all parts conventionally
- Adjust each lens position with MEMS
- Lock down with solder
Kaiam “optical wirebond technology” allows rapid integration of diverse components onto a single silicon platform with excellent optical coupling between the elements.
- Leverages generally available single-function chips, optimized for performance
- No need for complex monolithically integrated chips
- New PIC designs only require a new PCB — accelerates development cycles with less resources
- Test / burn-in before assembly leads to high yields — don’t reject the entire assembly because of one bad part
Kaiam‘s Smart Photonic Integration is the answer.
Kaiam 10-Channel EML-based TOSA is cooled with an internal TEC and designed to operate at 100GHz channel spacing on the ITU grid.
